Leadframe package with integrated partial waveguide interface

ABSTRACT

A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. Non-Provisional applicationSer. No. 14/088,077, entitled “LEADFRAME PACKAGE WITH INTEGRATED PARTIALWAVEGUIDE INTERFACE,” which was filed on Nov. 22, 2013. The '077application is a continuation of U.S. Non-Provisional application Ser.No. 13/221,693, entitled “LEADFRAME PACKAGE WITH INTEGRATED PARTIALWAVEGUIDE INTERFACE,” which was filed on Aug. 30, 2011 and issued asU.S. Pat. No. 8,592,960 on Nov. 26, 2013. The '960 patent claimspriority to U.S. Provisional Application No. 61/378,889, entitled“OVER-MOLDED LEADFRAME PACKAGE,” which was filed on Aug. 31, 2010. Allof the aforementioned applications are hereby incorporated by reference.

FIELD

The subject of this disclosure may relate generally to systems, devices,and methods for mounting and packaging mm-wave MMIC devices.

BACKGROUND

Typically a MMIC is connected to a printed wiring board (“PWB”), and theprinted wiring board is connected to a chassis. A stripline on the PWBmay convey an RF signal from the MMIC to a waveguide and the signal maythen be launched into the waveguide. This prior art example involvesrelatively expensive assembly procedures. The present disclosuredescribes lower cost methods and highly reliable devices for makingmillimeter wave packages that facilitate simpler assembly of higherlevel systems.

SUMMARY

In one example embodiment, a RF MMIC package is disclosed thatcomprises: a package body portion comprising a MMIC disposed within thepackage body portion; a partial waveguide interface; an overmoldmaterial forming portions of both the package body portion and thepartial waveguide interface so as to cause the partial waveguideinterface to be an integral part of the package body portion; and aleadframe, wherein the leadframe is electrically connected to the MMIC,and wherein the leadframe forms part of both the package body portionand the waveguide interface.

In another example embodiment, a method of forming a mm-wave MMICpackage is disclosed comprising the steps of: forming a leadframecomprising leads, wherein the leads include DC leads, RF leads, awaveguide transition, and an RF launch; overmolding at least a portionof the waveguide transition and portions of the leadframe, wherein theovermolding creates a package base that is integrated with a partialwaveguide interface, wherein the partial waveguide interface protrudesfrom the package base, wherein the integrated partial waveguideinterface comprises the waveguide transition and the RF launch; andattaching and electrically connecting a MMIC to the leadframe within thepackage base.

In yet another example embodiment, a MMIC package is disclosedcomprising: a leadframe based overmolded package, a die positionedwithin the overmolded package; and a partial waveguide interface,wherein the partial waveguide interface is integral with the overmoldedpackage.

In another example, a transceiver housing is disclosed that comprises: ametal chassis having a waveguide; a PWB attached to the metal chassis; apackage comprising a MMIC and a metal portion on a first surface of thepackage, the MMIC in direct thermal contact with the metal portion; thepackage electrically connected to the PWB, and wherein the metal portionof the package is attached directly to the metal chassis providing adirect heat sink path from the MMIC to the metal chassis; wherein thepackage comprises a portion of an waveguide interface that is integratedin the package, wherein the package is located so as to align a probeportion of the waveguide interface with the waveguide in the metalchassis; and a cover separately connected to the metal chassis, whereinthe cover is one of a metal cover or a metalized plastic cover, andwherein the cover forms a waveguide backshort for the waveguide.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features, aspects and advantages of the presentinvention will become better understood with reference to the followingdescription, appending claims, and accompanying drawings where:

FIG. 1 illustrates, for context, a perspective view of an examplesatellite transceiver system in accordance with various embodiments ofthe invention;

FIGS. 2A-2B illustrate an example leadframe at various steps in themanufacturing process in accordance with a first example embodiment;

FIG. 3 illustrates an example deep downset leadframe after transfermolding in accordance with a first example embodiment;

FIGS. 4A-4B respectively illustrate an example package after adding anexample die and after adding an example lid in accordance with a firstexample embodiment;

FIGS. 5A-5B illustrate, with top and bottom perspective viewrespectively, an example package after the leads have been trimmed andshaped in accordance with a first example embodiment;

FIG. 6 illustrates an example double leadframe in accordance with anearly step in the assembly process in a second example embodiment;

FIG. 7 illustrates an example double leadframe after transfer molding inaccordance with a second example embodiment;

FIG. 8 illustrates an example transfer molded double leadframe of FIG. 7with a base bonded thereto, in accordance with a second exampleembodiment;

FIGS. 9A-9B respectively illustrate an example package after adding anexample die and after adding an example lid in accordance with a secondexample embodiment;

FIGS. 10A-10B illustrate, with top and bottom perspective viewrespectively, an example package after the leads have been trimmed andshaped in accordance with a second example embodiment;

FIG. 10C illustrates an example cut away view of the overmold packagewith only the overmold material showing, in accordance with an exampleembodiment;

FIG. 10D illustrates an example lid in accordance with an exampleembodiment;

FIG. 10E illustrates an example side-by-side leadframe processing strip,in accordance with an example embodiment;

FIGS. 11A-11C illustrate, in perspective view, example leadframeembodiments (with or without the overmold), in accordance with variousembodiments;

FIG. 12A-12F illustrate various structures for tuning associated withthe leadframe;

FIG. 13 illustrates an example package placed on an example printed wireboard, in accordance with various embodiments;

FIGS. 14A-14B respectively illustrate two different example packagesplaced on an example printed wireboard, in accordance with two differentexample embodiments;

FIG. 15 illustrates an example assembly of FIG. 14 placed on an examplechassis associated with an example housing of a transceiver, inaccordance with various embodiments;

FIGS. 16A-16B respectively illustrate close up views of two differentexample packages placed on an example printed wireboard that is placedon an example chassis, in accordance with two different exampleembodiments;

FIGS. 17A-17D illustrate various configurations of the chassis and anassociated pedestal, a waveguide in the chassis, and the placement ofthese components relative to each other, in accordance with variousembodiments;

FIGS. 18A-18C illustrate example cover configurations, in accordancewith various embodiments;

FIGS. 19A-C provide further illustrations of example covers and/orexample assemblies comprising example covers, in accordance with variousembodiments; and

FIG. 20 illustrates various method steps for manufacturing the package,and/or higher level assemblies.

DETAILED DESCRIPTION

In accordance with various embodiments of the present invention,systems, devices, and methods are provided, for among other things,manufacturing a monolithic microwave integrated circuit (“MMIC”) packageand/or mounting the MMIC package in higher level assemblies. Thefollowing descriptions are not intended as a limitation on the use orapplicability of the invention, but instead, are provided merely toenable a full and complete description of various embodiments.

In accordance with various example embodiments of the present invention,a new MMIC package and method of manufacturing the MMIC package isdisclosed. As described in greater detail, in various embodiments, theMMIC package comprises a MMIC in an overmolded leadframe package. Invarious embodiments, the MMIC is completely enclosed in the package(hermetically sealed lid or complete overmolding). In other exampleembodiments, the MMIC package further comprises an integrated partialwaveguide interface. For example, a microstrip and launch (i.e., aportion of the waveguide interface) may be formed as part of the MMICpackage. In various embodiments, the remaining portion(s) of thewaveguide interface are provided when assembling the next higherassembly level.

Moreover, the leads from the package leadframe are configured, invarious embodiments, to alleviate tolerance issues in the next higherassembly level. In addition, the leads are configured to providemechanical stress relief between the host printed circuit board (“PCB”)and the package, but also to electrically maintain a matched RFimpedance on the leads used for RF interconnect. Additionally, invarious embodiments, special structures associated with the leads aredisclosed, which facilitate tuning the lead interface.

Also disclosed are various methods and structures for connecting theMMIC package to the next higher assembly level. For example, the MMICpackage may be configured to be in direct thermal contact with a metalchassis of the next higher assembly level. In this manner, the MMICpackage does not have a printed wiring board (“PWB”) interfering withthe thermal pathway between the MMIC in the MMIC package and a heat sink(in the chassis). Various example covers are also disclosed forcompleting the waveguide interface when assembled in conjunction withthe package.

With reference now to FIG. 1, although the disclosure herein may besuitable to various technologies, various embodiments will be discussedherein in the context of an example satellite radio frequency (“RF”)transceiver system. In this context, RF transceiver system 100 maycomprise a transceiver 110, an antenna feed system 120, and a dish 160.An antenna feed system 120 may comprise, for example, a feed horn 130, apolarizer 140, and an ortho-mode transducer (“OMT”) 150. RF transceiversystem 100 may be configured, for example, to communicate RF signalsbetween a modem and a satellite. It should be understood that variouscomponents and configurations may be used in any RF transceiver system,and that this example system 100 merely illustrates one system in whichthe MMIC package and other disclosure herein may be used.

Transceiver 110 may comprise one or more MMIC packages. Example MMICpackages and methods of manufacturing such packages will be described infurther detail beginning with reference to FIG. 2A. In accordance withvarious example embodiments, a MMIC package may comprise a leadframebased overmolded package (“overmolded package”), and a die. The die maybe positioned within the overmolded package. The MMIC package mayfurther comprise an integrated partial waveguide interface. The MMICpackage may comprise any suitable shape and configuration of components,but several example embodiments and methods for forming such embodimentsare described herein.

In one example embodiment, and with reference now to FIG. 2A, an exampleleadframe 200 is illustrated. Leadframe 200 may comprise a frame 210, apad 220, a strip-line 230, a launch 240, and various leads 250.Leadframe 200 may be formed, for example, by etching or stamping to forma desired pattern for leadframe 200. In various embodiments, lead frame200 is formed in strip form. In another example embodiment, leadframe200 is formed in an array. For example, a 1×4 array of leadframes couldbe formed. Moreover, any size and number of components may form an n×marray of leadframes. The array may further comprise features on some ofthe edges of the array to facilitate holding the part in themanufacturing equipment. Furthermore, any suitable method of formingleadframe 200 may be used.

Leadframe 200 may comprise any suitable conducting material. Forexample, leadframe 200 may comprise copper, copper alloy, suitablemetal, or any other suitable conducting material. In variousembodiments, leadframe 200 is nickel plated with wire-bondable goldplating. The material may be configured to conduct electricity well. Forexample, the material may be configured to have a conductivity greaterthan 10̂7 S/m. However any suitable conductivity may be used. Inaddition, the material may be configured to conduct RF signals atdesired frequencies. For example, the material may be configured to havesmooth surfaces and edges (preferably controlled within 10 um or better.The material may further comprise low non-linear ferromagneticproperties (such as with a permeability less than 10̂-3 H/m). However,any suitable configurations may be used. Also, the material may beconfigured to conduct heat well. For example, the material may have athermal conductivity greater than 200 W/m-K. However, any suitablethermal conductivity may be used. Furthermore, in various embodiments,leadframe 200 may comprise multiple materials, metal alloys, differentplatings and/or materials selected to have optimal combinations of theseproperties. As a non-limiting example, BeCu may be used in one exampleleadframe.

Leadframe 200, in various embodiments is flat, or undeformed (see forexample, FIG. 2A). In one example embodiment, the thickness of leadframe200 is from 0.002 to 0.100 inches. However any suitable leadframethickness may be used. In various embodiments, leadframe 200 is furtherprocessed through cutting, and or deforming various portions of theleadframe. For example, with reference to FIG. 2B, leads 250 andstrip-line 230 are severed from pad 220. In addition, pad 220 is offsetfrom the plane of frame 210. I.e., pad 220 is positioned to be “deepdownset.” Support elements 260 connect/support frame 210 to pad 220.These support elements 260 are deformed to cause pad 220 to be in adifferent plane than other portions of the leadframe, such as leads 250,frame 210, and/or strip line 230. Furthermore, any technique forfacilitating deep downset of pad 220 may be used. The deep downsetconfiguration, in various embodiments allows the pad 220, also known asthe “die paddle,” to be flush with the package bottom as will bedescribed further herein.

The cutting of portions of the leadframe may be performed using anysuitable technique. In one example embodiment, a laser is used to cutthe leads and/or strip-line. In other example embodiments, stamping orchemical etching are used to remove material from portions of theleadframe. Furthermore, any suitable technique may be used to removeportions of the leadframe. Moreover, the deforming of portions of theleadframe may be performed using any suitable technique. In one exampleembodiment, stamping may be used to deform support elements 260.Furthermore, any suitable deformation techniques may be used.

With reference now to FIG. 3, in various embodiments, leadframestructure 200 is overmolded. This process may be called Transfer Moldingor Overmolding. For example, an overmold material 300 may be injectedaround portions of leadframe 200. In various embodiments, theovermolding is accomplished using injection molding. In another exampleembodiment, the overmolding is done in strip form (i.e., in a batch orin an array format). In further example embodiments, the overmold may beprovided using casting techniques. Furthermore, the overmold may beformed using any suitable process for molding plastic. Furthermore, theovermold process may comprise any suitable technique for forming amaterial around portions of leadframe 200.

Material 300 may be formed around portions of the leadframe in such away as to hold and/or support leads 250, pad 220, and/or strip-line 230in a set position. For example, material 300 may be formed aroundportions of leadframe 200 so as to hold pad 220 in deep downsetconfiguration relative to other portions of leadframe 200 such as leads250 and/or strip-line 230.

In various embodiments, overmold material 300 is configured to form astructure suitable for containing an electronic device. In one exampleembodiment, the electronic device is a MMIC. In one example embodiment,the overmold material forms an overmolded “body structure” or “a packagebase.” In another example embodiment, overmold material 300 forms sidesof a box like structure with pad 220 forming the bottom of the box. Thebox or body structure (also described herein as a “package base”) isconfigured to receive, an electronic device. For example, the bodystructure or box may be configured to receive a MMIC. The overmoldmaterial 300 may be shaped to form any suitable structure configured tocontain a MMIC and or the like device. Thus, in one example embodiment,overmold material 300 forms at least part of a cavity for receiving aMMIC. For sake of clarity, the overmold material does not necessarilyhave to form a box with sides, but could be any suitable structure forholding portions of leadframe 200 and an electronic device (e.g., MMIC).

Overmold material 300 is only formed around a portion of leadframe 200.For example, launch 240 may be left with no overmold material 300surrounding or touching the launch. In another example embodiment,microstrip 230 is supported, but not covered by overmold material 300.As an aside, it is noted that the term “microstrip” is used throughoutthis specification, however, it should be understood that many suitablemethods may be used for communicating RF signal including coaxial andother waveguide transition devices. Thus, wherever the term “microstrip”is used herein, it should be understood to mean any similar device forconveying the signal. In yet another example embodiment, pad 220 isexposed on both sides and is generally not covered be overmold material300 except possibly near the edges of pad 220. However, in variousembodiments, overmold material 300 may be over, under, and/or aroundportions of leadframe 200. In other words, the MMIC package ultimatelyformed may comprise a leadframe at least partially enclosed in anovermold material.

Furthermore, portions of leads 250 may be exposed both inside theovermold structure and outside the overmold structure. In this manner,leads 250 may protrude from overmold material 300 and/or a portion ofleads 250 may be exposed inside the overmold structure to form bondpads. These bond pads may facilitate wire bonding to the electronicdevice to be received in the package.

It is noted that the thickness of overmold walls of the sides of the boxor body structure may be the same on all sides, or may be made ofdifferent thickness as desired. In one example embodiment, the thicknessis thicker on the DC input sides and thinner than that on the RFinput/output sides. In various embodiments, the dielectric material maybe minimized near the RF interconnections. This may facilitate areduction in loss in the signals communicated through the RFinterconnections.

In accordance with various embodiments, overmold material 300 maycomprise an injection molded plastic, a ceramic material, a polymer,and/or any dielectric moldable material. In various embodiments, thepolymer may comprise a liquid crystal polymer (LCP).

Although described herein most commonly with the polymer being a LCP, inother example embodiments cheaper more common die overmolding polymersmay be used. This is particularly the case for applications where higherinterface losses can be tolerated. Thus, in other example embodiments,the polymer comprises one of the following polymers: LCP, PolyphenyleneSulfide (PPS), Polyether ether ketone (PEEK), any thermoplastic polymer,and any thermoset polymer. Thus, overmold material may comprise anysuitable material for casting, injection molding, or otherwiseovermolding leadframe 200 as described herein. Furthermore, suitablematerials may comprise low dielectric constant and/or low loss tangentmaterials.

In accordance with various embodiments, and with reference now to FIG.4A, an electronic device is added to the package. In one exampleembodiment, the electronic device is a die. In another exampleembodiment, the die is a MMIC. In accordance with various embodiments,the MMIC comprises one of the following: a high power amplifier, and ablock up converter (“BUC”). Furthermore, in various embodiments, theMMIC comprises a high power, high frequency device. For example, highpower, high frequency devices may comprise devices operating atfrequencies greater than 10 GHz and at power levels greater than 1 W. Inanother example, high frequencies may be frequencies of 8 GHz or higherand high power may be greater than 5 watts, greater than 8 watts, orgreater than 10 watts. However, any suitable power and frequency levelsand combinations thereof may be suitable.

MMIC 400 may be placed in physical contact with pad 220. In variousembodiments, placement of MMIC 400 in contact with pad 220 facilitatesheat transfer from MMIC 400 to pad 220. In this example embodiment,there is no object between MMIC 400 and pad 220 that would interferewith the heat transfer. In various embodiments, MMIC 400 is kept inphysical contact with pad 220 by a conductive epoxy, soldering, anysuitable method of electrically conductive bonding, and/or any othersuitable method of securing MMIC 400.

In accordance with various embodiments, MMIC 400 is electricallyconnected to leadframe 200 via wirebonds. More specifically, in variousembodiments, MMIC 400 is attached to DC and RF interfaces (leads) atbond pads on the leads inside the package. For example, one or more bondpads on MMIC 400 may be connected to a bond pad on one or more of leads250. Wirebonding is well known in the art and will not be described infurther detail herein. Furthermore, flip chip, high densityinterconnect, and other suitable methods of electrically connecting MMIC400 may be used as appropriate.

With reference now to FIG. 4B, the electronic device, die, or MMIC (asthe case may be), may be enclosed in a package 410 (also describedherein as “a package body portion”). Although it has been noted that thepackage may contain any electronic device or die, the package may forconvenience be described herein as a MMIC package 410. But it should beunderstood that the disclosure is equally applicable to packagescontaining such other electronic devices.

Package (or MMIC package) 410 may suitably completely enclose the MMIC.In various embodiments, this enclosing of the MMIC may be effected byway of using a lid or through further overmolding. In other words, theMMIC may be enclosed in a package body portion comprising a package baseand a package lid.

In various embodiments, MMIC package 410 or “the package body portion”may comprise a lid (package lid) 420 and an overmold box (or packagebody portion) 430. Lid 420, in various embodiments, comprises at leastone of the following materials: injection molded plastic, ceramic,stamped plastic, metal, and/or the like. In various embodiments, thesematerials may be one of: metal plated and not metal plated. Furthermore,in various embodiments, a radio frequency absorbing material is providedon a first surface of the package lid. This first surface of the packagelid may be described as facing the interior of the package. In variousembodiments, the first surface may be described as facing the electronicdevice, facing the die, or facing the MMIC. Moreover, the radiofrequency absorbing material, in one example embodiment, comprises“Ecosorb.”

Lid 420 may be secured to overmold box 430 using any suitable technique.For example, a glue may be used to connect the two objects. In oneexample embodiment, a B-Staged Epoxy is used to attach lid 420.Furthermore, in various embodiments, lid 420 is sealed to overmold box430. Such sealing may be performed, for example using an ultrasonic lidseal. Furthermore, any suitable techniques may be used for sealing orotherwise attaching lid 420 to overmold box 430. In various embodiments,the seal may be a hermetic seal.

Thus, in accordance with various embodiments, a MMIC package (orovermolded package body portion) may comprise: a package lid and anovermolded package base; wherein the package lid and the overmoldedpackage base are connected together so as to hermetically seal the diewithin a cavity inside the overmolded package body portion.

In one example embodiment, and with momentary reference now to FIG. 10D,an example lid may comprise a raised middle portion. This raised middleportion may be configured to facilitate alignment of the lid and baseportion, and/or sealing/attaching of the lid to the base portion. Inanother example embodiment, the raised middle portion is configured tofacilitate positioning the RF absorbing material that is attached to theraised middle portion.

In accordance with other example embodiments the overmolded package is afully encapsulated overmolded package. In various embodiments, the MMICis fully encapsulated by adding overmold material over the MMIC afterplacing/wirebonding the MMIC within the overmolded package. For example,injection molding may be used to finish encapsulating the MMIC in thepackage.

With reference now to FIGS. 5A and 5B, the MMIC package may be furtherprocessed by bending the protruding leads into a desired shape as may befurther described below. The leads may comprise, for example, bias inputleads 502, and microwave input leads 504.

In various embodiments, a MMIC package 500 further comprises anintegrated partial waveguide interface 550. Integrated partial waveguideinterface 550 may further comprise a microstrip portion 530 and a launch540. Again, it is noted that the microstrip could be any suitablestructure for communicating an RF signal along integrated partialwaveguide interface 500 (e.g., waveguide transition, coaxial, and or thelike). The microstrip portion 530 may comprise a microstrip and anovermold material. The microstrip may be at least partially overmolded.Stated another way, the microstrip may be at least partially supported,by an overmold material. In one example embodiment, the overmoldmaterial may be only on one side of the microstrip. In another exampleembodiment, the microstrip may be covered by the overmold material.Furthermore, although shown as covering the entire length of themicrostrip, the overmold material may only be in contact with themicrostrip for a portion of its length. Thus, the overmold material maybe in contact with at least a portion of the microstrip.

Although described herein as a package comprising an integrated partialwaveguide interface, in various embodiments, the waveguide interface isnot integrated with the MMIC package. Moreover, the partial waveguideinterface may comprise a transmission line (e.g., microstrip, coaxial,stripline). The stripline may be, for example, a suspended stripline. Invarious embodiments where the overmold material is under the microstrip,the overmold material may be from 2 mils to 60 mils thick, and invarious embodiments may be 5 mils to 30 mils thick, and in variousembodiments may be about 10 mils thick. Furthermore, any suitablethickness of overmold material under the microstrip may be used.

The microstrip portion may facilitate providing a filtering function forthe signal communicated along the microstrip. In this regard, theovermold may be a dielectric material. The microstrip portion mayfunction as a suspended strip-line. In various embodiments, themicrostrip portion is a 50 ohm line. Moreover, the line, in variousembodiments, may be configured to have an impedance in the range of 5ohms to 400 ohms. Furthermore, any suitable impedance for the line maybe used. In various embodiments, the microstrip portion is configured toextend the probe from the package. In various embodiments, themicrostrip portion may extend a short distance, such as from 0.1 inchesto 1 inch. However, any suitable extension length may be used.

In various embodiments, the word integrated in the phrase “integratedpartial waveguide interface” means that the overmold material of themicrostrip portion 530 is integral with the overmold material of theovermold package. The microstrip portion 530 may comprise the sameovermold material as used in the rest of the overmolded package. Inother various embodiments, different overmold material may be used indifferent locations of MMIC package 500.

In various embodiments, launch 540 is not overmolded. In other variousembodiments, launch 540 is overmolded on one side. For example, theovermold material may extend under the probe. The supporting materialmay thus be in contact with all of the microstrip, and/or part or all ofthe launch. Such variations may involve tradeoffs with respect to signalquality and robustness.

In accordance with various embodiments, launch 540 is an e-plane launch.As an e-plane launch, launch 540 is configured to launch a signal into awaveguide perpendicular to the microstrip/launch. In accordance withother various embodiments, launch 540 is an H-plane launch. As anH-plane launch, launch 540 is configured to launch straight ahead.Furthermore, launch 540 may be any suitable type of launch or maycomprise any other waveguide transition known or hereinafter discovered.

In some embodiments, MMIC package 500 comprises more than one integratedpartial waveguide interface. For example, one integrated partialwaveguide interface may be an input interface and another integratedpartial waveguide interface may be an output interface. In other exampleembodiments, multiple input and/or output interfaces may be formed asintegrated partial waveguide interfaces. One example embodiment maycomprise two or more input interfaces and a single output interface, allconfigured as integrated partial waveguide interfaces. Another exampleembodiment may comprise a single input interface and two or more outputinterfaces, all configured as integrated partial waveguide interfaces.

It is noted, with reference to FIG. 5B, that pad 220, also known as a“die paddle” is located in the package so as to be flush with the bottomof MMIC package 500. In one example embodiment where the die paddle isnot flush with the bottom of MMIC package 500, and with momentaryreference now to FIG. 100, a slot in the overmold is configured to holdthe leadframe.

It is further noted that the microstrip portion 530 and launch 540 ofintegrated partial waveguide interface 550 does not comprise a completewaveguide interface. At least a cover is missing to call it a completewaveguide interface. Thus, interface 550 is denominated a partialwaveguide interface. And because this partial waveguide interface isintegral with the MMIC package, it is more particularly denominated anintegrated partial waveguide interface. Thus, MMIC package 500 comprisesan integrated partial waveguide interface.

Stated another way, in accordance with various embodiments, asemiconductor device may comprise a MMIC package including a MMIC and apartial waveguide interface molded into the molded MMIC package. Inaccordance with another example embodiment, a mm-wave MMIC packagecomprises an overmolded leadframe package and an integrated wave guideinterface that does not include an integrated waveguide backshort. Inaccordance with another example embodiment, a mm-wave MMIC packagecomprises an overmolded leadframe package and an integrated partial waveguide interface, wherein the integrated partial waveguide interface isconfigured to work in conjunction with a separate waveguide backshort.

In accordance with another example embodiment, a high power, highfrequency MMIC package comprises one or more integrated partialwaveguide interfaces, wherein the MMIC in the MMIC package is one of apower amplifier and a block up-converter. In this example embodiment,each of the one or more integrated partial waveguide interfaces are oneof: an input interface and an output interface. In another exampleembodiment, each of the one or more integrated partial waveguideinterfaces comprise: two input interfaces and two output interfaces. Invarious embodiments, an amplifier comprises both a waveguide input and awaveguide output.

One example embodiment may comprise a QFN package plus “half” awaveguide interface. The other portion or “half” is provided at a higherassembly level, as discussed in further detail herein.

In accordance with a different example embodiment, and with reference toFIG. 6, two leadframe assemblies may be used in forming a MMIC package.One of the two leadframe assemblies may be formed much like theleadframe assembly described with reference to FIG. 2A. For example, aleadframe 600 may comprise a frame 610, a pad 620, a strip-line 630, alaunch 640, and leads 650. Furthermore, a second leadframe 601 may beformed. The leadframes may be formed using similar techniques asdescribed above, and so that discussion will not be repeated here. Itwill be noted, however, that pad 620 is discarded, and that supportstructures for such pad 620 may be omitted in this example embodiment.For simplicity, the term leadframe package is intended to include apackage formed using one leadframe or a package formed using multipleleadframes. The use of a second leadframe provides another degree offreedom in design in that the thickness and/or materials of the secondleadframe can differ from that of the first leadframe. This facilitatesmaking the base leadframe thicker without impacting the thickness of theleads.

With reference now to FIG. 7, leadframe 600 may be overmolded similar tothe overmolding described with reference to FIG. 3. It is noted that, invarious embodiments, there is no pad (also known as a base or pedestal)at this stage in the overmolding process. The second leadframe 601 (alsoknown as a base leadframe) may, with reference to FIG. 8, be bonded tothe overmolded first leadframe. This can be done, for example, in anarray of leadframes.

With reference now to FIGS. 9A-9B, an electronic device, die, or MMIC ispositioned inside the overmolded leadframe package, and wirebonded asdescribed above. In this example embodiment, however, the electronicdevice is in contact with the base leadframe instead of with a pad fromthe first leadframe. The electronic device may be enclosed within thepackage as described above. For example, using a lid or overmolding toenclose or encapsulate the device. The double leadframe MMIC package isthen trimmed from the frame of the first leadframe and the leads areshaped. These steps may take place as described above. With referencenow to FIGS. 10A and 10B, the resulting MMIC package 1000 is similar tothat described with reference to FIGS. 5A and 5B, except that baseleadframe 601 extends under the entire package. In other variousembodiments, base leadframe 601 extends under only a portion of theentire package.

In accordance with another example embodiment, the package may beprocessed in parallel with the making of other packages. For example,several packages may be formed simultaneously in the same leadframe.With momentary reference to FIG. 10E, an example 8×1 strip may be usedfor forming the leadframe, overmolding the formed leadframe, insertingthe MMIC, and encapsulating/enclosing the MMIC. Any suitable number andarrangement of devices may be used for simultaneously processing severalpackages at the same time.

Thus, in accordance with various embodiments, a MMIC package maycomprise: a leadframe based overmolded package (“overmolded package”), adie positioned within the overmolded package; and a partial waveguideinterface, wherein the partial waveguide interface is integral with theovermolded package. In various embodiments, the overmolded package doesnot comprise a printed wiring board.

Turning now in more detail to a discussion of the leads, in variousembodiments, use of the package in a surface mount configuration isanticipated. Such surface mount use may give rise to mechanical stressesin the package and tends to give rise to a need for tight tolerances.Because such stresses and tight design criteria for the tolerances aretypically undesirable, in one example embodiment, spring like leads areused at the DC and RF interfaces. These spring like leads are configuredto take up mechanical stresses and tolerances. For example, the springleads are designed to have a suitable length and shape. Unfortunately, amechanically elastic design may be inclined towards longer leads with alarger height, whereas at microwave frequencies, a better electricalperformance will be achieved with shorter leads having little height.

Therefore, in various embodiments, the length and shape of the leads aredesigned to optimize mechanical elastic properties as well as electricalperformance properties. Thus, various RF tuning techniques may beimplemented in the design of the leads.

With reference now to FIGS. 11A-11C, leads 1150 and 1151 may be formed(e.g., using cutting or stamping, or the like) and shaped. The leadsform at least one DC interface and at least one RF interface. In variousembodiments, the DC and RF interfaces are configured to connectelectrically to a printed wiring board (“PWB”). The leads may have an“S” shape, in one example embodiment. In other various embodiments, anyshape may be used that provides a spring like flexibility facilitatingreduced stress and good contact when the package is surface mounted tothe next higher assembly level. The leads may be designed to take up 2-9mils or more of deflection. Moreover, in various embodiments, someapplications may involve the leads taking up deflection on the order of100 mils. Thus, the leads may be configured to take up any desiredamount of deflection. Moreover, the leads may be 160 mils long, howeverany suitable length of the leads to facilitate taking up the desireddeflection may be used.

It is noted that leads 1150 may be DC bias leads, and leads 1151 may beRF leads. In this regard, some RF tuning may be performed by designingthe leads in such a way as to offset the RF performance issues that mayarise due to the length of the leads. It is noted that these tuningtechniques are dependent on the frequency of the RF signals. Theintermediate frequency signal and local oscillator signals conveyed overleads 1151 each are associated with a frequency and the design of theleads for tuning will generally be based on that frequency.

For example, and with reference now to FIGS. 11A and 12A-F, the spacingbetween leads may be used to affect tuning (e.g., FIG. 12A). In anotherexample embodiment, the width of the leads may be used to effect tuning(e.g., FIG. 12A). In another example embodiment, some of leads 1151 maybe designed with specific shapes in the vicinity of the packageovermold. Such shapes may facilitate impedance tuning.

In various embodiments, shaped leads might comprise: tapered leads(e.g., FIG. 12B), straight leads (e.g., FIG. 12C), neck-up leads (e.g.,FIG. 12D—showing the lead getting wider and then narrower) in certainareas, and neck-down leads (e.g., 12E—showing the lead stepping down toa narrow lead and then stepping back up in width. Such shaping may occurduring the process of cutting out the leadframe shape. Furthermore, anyother suitable tuning methods may be used for on-package tuning, such ascustomizing the wire lengths, adjusting the positions of the end of thewire on the leads, and adjusting the proximity to ground.

Moreover methods of tuning the RF signal carried over the leads may beimplemented at the package/PWB interface. With reference now to FIG.12F, in another example embodiment, off-package tuning techniques areutilized to further tune the RF signal to compensate for the length ofthe leads. Such off package lead tuning techniques may include use ofshaped leads on the printed wiring board (similar to shaped leads usedon the MMIC package). Such may also involve a ground-signal-groundarrangement (coplanar waveguide structure).

In accordance with various embodiments, the MMIC package may be used inthe next higher assembly level. For example, the MMIC package may beused in a transceiver. Moreover, the MMIC package may be used in anysuitable higher level assembly. For example, the MMIC package may beused in high power amplifiers and/or high power millimeter wave modules,or any suitable higher level assembly.

In such higher level assemblies, the MMIC package may be surfacemounted. Several embodiments of such an assembly are described, butother assemblies may also be implemented. In one example embodiment, theMMIC package is placed on a printed wiring board (“PWB”). The PWB isplaced on a chassis and/or within a housing.

The PWB, in various embodiments comprises any type of printed wiringboard (also known as printed circuit board). The PWB is configured tofacilitate surface mounting of the MMIC package. With reference now toFIG. 13, an example PWB 1310 may be connected to MMIC package 1300. MMICpackage 1300 may be physically positioned on PWB 1310 usingpick-and-place technology. Moreover, any suitable method of placing MMICpackage 1300 on PWB 1310 may be used. Various leads of MMIC package 1300may connect with bond pads on PWB 1310. The leads, in one exampleembodiment are reflow soldered to the bond pads. Moreover, any suitableinfrared reflow, wave soldering, or any other suitable surface mountingtechniques may be used to electrically connect MMIC package 1300 to PWB1310.

PWB 1310 may further have a hole 1320. Hole 1320 is, in one exampleembodiment configured to facilitate thermal and RF communication betweenMMIC 1300 and the chassis on which PWB 1310 is to be connected. Hole1310 may be any size or shape as suitable. Hole 1320 may also bereferred to as a “part bridge.” With reference now to FIGS. 14A and 14Brespectively, it is noted that for either of the example embodimentsdescribed above (i.e., a single leadframe package or a double leadframepackage), the underside of MMIC packages 1400A/1400B are exposed due to(or through) the part bridge 1320 cut in PWB 1310.

In this regard, part bridge 1320 is configured to facilitate MMICpackage 1300 contacting a heat sink on a chassis via part bridge 1320.It will be noted that for MMIC package 1400A, the single leadframepackage, the die paddle is aligned with part bridge 1320 in PWB 1310.Similarly for MMIC package 1400B, a double leadframe package, the baseleadframe 1401 is aligned with part bridge 1320 in PWB 1310. Thus,exposing the underside or “bottom” of packages 1400A and 1400Bfacilitates heat transfer to a heat sink located on the opposite side ofPWB 1310.

Part bridge 1320 further provides a bridge to a waveguide located in achassis, where the chassis is primarily located on the side of the PWBopposite MMIC package 1300. In these various embodiments, the launch isaligned over part bridge 1320.

In accordance with a first example embodiment, and with reference now toFIG. 15, MMIC package 1500 is first electrically connected to PWB 1510and then PWB 1510 is placed in contact with a chassis. In accordancewith another example embodiment, PWB 1510 is connected to the chassisand then MMIC package 1500 is connected to PWB 1510.

Either way, in accordance with various embodiments, a transceiver (e.g.,transceiver 110 from FIG. 1) may comprise a housing into which PWB 1510and MMIC package 1500 are placed. The transceiver housing may comprise afirst portion and a second portion. The first portion may also be calleda top portion and the second portion may be called a bottom portion.Furthermore, the first portion may be called a lid in some exampleembodiments. The first portion/top portion/lid is not illustrated, butan example second portion or bottom portion 1570 is illustrated in FIG.15.

It will be noted that in various embodiments, bottom portion 1570 of thehousing may be called a chassis. In other words, the chassis and thebottom portion 1570 of the housing may be one part. In other exampleembodiments, the bottom portion 1570 of the housing may be formed frommultiple parts. In this second example embodiment, a chassis may beconfigured to drop into bottom portion 1570 of the housing. Thus, PWB1510 may be located on bottom portion 1570 or PWB 1510 may be located ona chassis that is located on bottom portion 1570. Non-limiting examplesof housing and chassis embodiments are disclosed in U.S. patentapplication Ser. No. 12/268,840, “Integrated OMT” and Ser. No.12/614,185, “Molded Orthomode Transducer” the contents of which areincorporated by reference in their entirety for their treatment ofexample higher level assemblies.

In any event, PWB 1510 comprises a first side and a second side oppositethe first side. MMIC package 1500 may be on the first side and astructure that is attached to the second side may comprise a waveguide.This structure will be generically called a chassis herein and it willbe understood that the chassis is a portion comprising a waveguide and aheat sink, regardless of the number of components or configuration ofthe chassis/bottom portion of the housing.

The chassis may comprise a pedestal. The pedestal may be a raisedportion of the chassis. The raised portion, in various embodiments isconfigured to extend through the part bridge in the PWB. With referencenow to FIGS. 16A and 16B, single leadframe and double leadframe MMICpackages 1600A and 1600B, respectively, in various embodiments, are incontact with a raised pedestal 1660 of the chassis. Moreover, launch1640 is suspended over a waveguide 1680.

With reference now to FIGS. 17A-17D, a pedestal may exist on thechassis. In various embodiments, a pedestal 1760 is a raised portion ofchassis 1770. Pedestal 1760 may be formed by removing material fromchassis 1770. For example, material may be removed by etching, grinding,laser ablation, chemical etching, stamping/coining and/or the like. Inanother example embodiment, pedestal 1760 is formed by adding materialto chassis 1770. For example, material may be added by welding,deposition, and or other suitable techniques. Moreover pedestal 1760 maybe formed by casting, metal injection molding, and/or the like. Anysuitable method of making pedestal 1760 may be used.

Pedestal 1760 may be formed of the same material as chassis 1770. Inanother example embodiment, pedestal 1760 is formed from a differentmaterial than chassis 1770. The pedestal and/or chassis material maycomprise one of the following: metal, aluminum alloy, copper, zinc, orany metal alloy. Moreover, pedestal and/or chassis material may compriseany suitable material.

Pedestal 1760 may be configured to support MMIC package 1700. In anotherexample embodiment, pedestal 1760 is configured to provide a thermalpath from MMIC 1700 to chassis 1770. Therefore, in an example singleleadframe MMIC package, such as illustrated in FIG. 17B, the pedestalmay be shaped to fit inside the lip formed from the overmold materialand to contact the pad 1720. In various embodiments then, pedestal 1760may comprise multiple steps. Pedestal 1760 may for example comprise afirst portion 1761 of a first height. Pedestal 1760 may for examplecomprise a second portion 1762 of a second height. The first portion1761 may suitably support the overmold material and/or microstripportion of MMIC package 1700. The second portion 1762 may be configured,in various embodiments to make a thermal contact with the pad 1720 onthe underside of MMIC package 1700. Thus, in various embodiments, secondportion 1762 of pedestal 1760 may comprise a surface configured forbeing placed in thermal contact with pad 1720 of MMIC package 1700.

With reference to FIG. 17C, the pedestal may be at least partiallysurrounded by a PWB 1710. For example, PWB 1710 may be located on oneend and partially on both sides of pedestal 1760. However, in anotherexample embodiment, PWB 1770 may surround the pedestal (see for example,FIG. 15). PWB 1770 may be mounted to or in contact directly with chassis1770. In other example embodiments PWB 1770 may be mounted to or incontact with one or more objects or layers that are mounted to or incontact with chassis 1770.

It should be noted that in the example embodiment comprising a doubleleadframe, the base leadframe is continuous and a single step pedestalmay be used. For that matter, if the base leadframe is of sufficientheight, the pedestal could be eliminated.

With momentary reference to FIG. 17D, a number of structures each havetheir own manufacturing tolerances. For example, the height of thepedestal (L_(pedestal)), the height of the base leadframe (L_(base)),the height of the package from the bottom of the package to the bottomof the leads (L_(package)), the height of the spring when not deflectedunder force (h_(spring)), and the height of the PWB (L_(board)). Thesummation of several such manufacturing tolerances can make it difficultto consistently manufacture a combined assembly where good thermalcontact is made, without stresses or strains on the MMIC package. Asmentioned above, in accordance with various embodiments, the springyleads facilitate taking up the manufacturing tolerances, and/or relievesstrain from thermal mismatches.

As mentioned before, the MMIC package may be configured to be in thermalcontact with the chassis. This may be accomplished for example via apedestal that is in thermal contact with both the MMIC package and thechassis. The chassis may serve as the heat sink. In various embodiments,and with reference to FIG. 15, the chassis/housing comprises fins fordissipating heat from the chassis to the environment.

Thus, in various embodiments, a housing comprises: a metal chassishaving a waveguide; a PWB attached to the metal chassis; a packagecomprising an MMIC and a metal portion on a first surface of thepackage, and a cover separately connected to at least one of the metalchassis and the package. In this embodiment, the MMIC is in directthermal contact with the metal portion, the package is electricallyconnected to the PWB, and the metal portion of the package is physicallyin contact with the metal chassis providing a direct heat sink path fromthe MMIC to the metal chassis.

Thus, the paddle/base leadframe each serve as a thermal interfacebetween the MMIC and the pedestal/chassis. The raised pedestal in thechassis is configured to mate to the paddle or base leadframe. Invarious embodiments, thermal grease or epoxy may be used between thepedestal and the paddle or base leadframe.

In various embodiments, the use of a deep downset pad and placing theMMIC or other electronic device on the pad facilitates removing heatefficiently from the MMIC package. Similarly, the use of a baseleadframe and placing the MMIC on the base leadframe facilitatesremoving heat efficiently from the MMIC package. These techniquesfacilitate thermal enhancement, which is defined to mean improving therate of heat transfer from the MMIC package when compared to a MMICpackage that does not employ the use of such techniques. Furthermore,thermal enhancement may be achieved by any suitable arrangement whereinthe MMIC is separated from the chassis by nothing more than leadframematerial. Stated another way, in various embodiments, the die in theMMIC package has a direct thermal path through a portion of theleadframe to the exterior of the overmolded package. The die in the MMICpackage may also have a direct thermal path through a portion of theleadframe to the chassis.

In various embodiments, the MMIC package comprises a heat sinkinterface. The heat sink interface is a portion of a leadframe. The heatsink interface may be located on a “bottom side” (i.e., the side closestto the chassis) of the MMIC package. Although, in other exampleembodiments, the heat sink may be the lid. The heat sink interface maybe integrated in the overmolded package. In some example embodiments,the heat sink is flush with a bottom surface of the overmolded package.In other example embodiments, the heat sink interface is recessed withinthe MMIC package.

At a system level, an example transceiver comprises an overmoldedpackage, a chassis, and a PWB, wherein the overmolded package is inelectrical contact with the PWB and wherein an electrical device withinthe overmolded package is in thermal contact with the chassis. In oneexample embodiment, the heat sink interface is in direct contact withthe chassis when the overmolded package is in contact with the PWB. Invarious embodiments, the PWB does not interpose between a heat transferportion of the package and a pedestal portion of the chassis. In otherexample embodiments, the MMIC package comprises a second leadframe thatis a heat sink leadframe, wherein the heat sink leadframe is in directcontact with the chassis. It should be noted that in this discussion,the pedestal is considered to be part of the chassis.

It is noted that in various embodiments, power amplifiers may be highpower, high frequency power amplifiers. In some example embodiments,this may mean that the frequency may be greater than 10 GHz and the RFpower may be greater that 1 W or the dissipated power may be greaterthan 5 W. However, the high power, high frequency power amplifiers maycomprise other suitable frequencies and power level combinations.

In accordance with another example embodiment, the cover provides asecondary heat sink path for the package.

With reference now to FIGS. 18A-18C, and FIGS. 19A-19C, it is noted thatalthough the launch and the waveguide are now aligned with and inproximity to the waveguide, at this stage in the assembly process thewaveguide interface is incomplete. In various embodiments, a cover,e.g., 1890A-1890C, is provided to complete the waveguide interface.

The cover may comprise any suitable material. For example, the cover maybe made of metal, metalized plastic, Zn, and/or the like. In variousembodiments, the cover is die cast, stamped, machined, etched, and/orthe like. Furthermore, any method of manufacturing the cover may beused. The cover may be an electrically conductive cover.

In various embodiments a cover, e.g., 1890A-1890C, is attached tochassis 1870. The cover may be attached using bolts, screws, epoxy,clamps, and/or any suitable attachment method.

Covers 1890A-1890C, respectively, provide a clamping force for securingMMIC package 1800 to the PWB (not shown). Thus, cover 1890A and 1890Ccover a small portion of MMIC package 1800 and provide a clamping force.In accordance with another example embodiment, a cover may be placedover a large portion of MMIC package 1800. For example, cover 1890Bcovers all of MMIC package 1800. It is noted that similar types ofcovers may be used in connection with single and double leadframeovermolded packages.

In accordance with various embodiments, the overmolded package ismounted to a chassis and the cover is mounted over at least the partialwaveguide interface. Furthermore, the cover may be mounted over more orless of the MMIC package. The cover may provide a holding force thatretains the overmolded package in fixed position relative to thechassis.

In various embodiments, the cover is a separate component from theovermolded package and also a separate component from the chassis. Inone example embodiment, the cover is just the transceiver lid.Furthermore, the cover may additionally form certain shielding wallsassociated with the package, if desired.

Covers 1890A-1890C each, in various embodiments, comprise a backshort.Each may comprise a partial RF channel leading into the waveguide. In afurther example embodiment, cover 1890A-1890C may comprise astep-launch. Furthermore, any suitable transition to waveguide may beused as now known or hereinafter invented.

The cover may be located over part of the integrated partial waveguideinterface. Stated another way, the launch may be enclosed between thechassis and the cover. Thus, a wave guide interface comprises, invarious embodiments, the cover and the MMIC package (comprising anintegrated partial waveguide interface). In various embodiments, apartial interface is a first portion of the waveguide interface and thecover is a second portion of the waveguide interface. In this exampleembodiment, the first and second portions of the waveguide interfacecomprise a whole waveguide interface. Moreover, the cover may comprisewalls in addition to a top portion.

The cover provides a clamping/bolt down′ function for securing theovermolded package relative to the chassis. In the prior art, a packageis typically designed so that the bolt down function is part of thepackage—as opposed to having that function provided by an externalcomponent. However, in various embodiments, the overmolded package isclamped between a portion of the cover and the chassis. In accordancewith various embodiments, the cover provides a secondary heat transferpath for removing heat from the overmolded package. The cover may beconfigured to direct RF signals between the launch and the WG.

Thus, in accordance with various embodiments, a transceiver comprises: asurface and a MMIC package, wherein the surface is configured to supportthe MMIC and transfer heat away from the MMIC, wherein the MMIC packageis configured to be surface mounted to the surface, wherein the MMICpackage comprises no bolt holes and is not directly bolted to thesurface; and a cover, wherein the MMIC package is held in contact withthe surface by the cover, wherein the cover is bolted to the surface,and wherein the cover partially covers the MMIC package.

In accordance with another example embodiment, a MMIC package, forsurface mounting to the next assembly level, comprises: a leadframebased overmolded package (“overmolded package”), and a die positionedwithin the overmolded package; wherein the package specifically excludesbolt holes for surface mounting to the next assembly level. In furtherexample embodiments, the MMIC package further comprises a cover thatincludes bolt holes for surface mounting the cover to the next assemblylevel and the cover provides a force to hold the MMIC package to thenext assembly level.

In one example embodiment, and with reference to FIG. 19C, cover 1990comprises a surface 1991 configured for contact with a MMIC package andfor providing a clamping force over the MMIC package. Surface 1991 mayfurther be covered with an RF foam. For example, CRS-124 fromEmmerson-Cumming Corporation, or similar materials may be used. The RFfoam may facilitate RF isolation of the package. The RF foam may furtherprovide some spring for the protection of the MMIC package from stressand strains.

With reference to FIGS. 19A and 19B, an example exploded view and anexample assembled view of a chassis 1970 and PWB 1910 assembly isdiscussed. In various embodiments, a MMIC package 1900 is connected toPWB 1910 electronically and to chassis 1970 thermally, with a cover1990. Cover 1990 has a RF absorptive material 1991 connected thereto.

In accordance with another example embodiment, not shown, an overmoldedpackage (MMIC package) is formed as described herein, but without anintegrated partial waveguide interface.

Thus, in accordance with various embodiments described herein, a housingcomprises: a metal chassis having a waveguide; a package having aportion of an waveguide interface that is integrated in the package,wherein the package is attached directly to the metal chassis aligning aprobe portion, of the portion of the waveguide interface, with thewaveguide in the metal chassis; and a cover separately connected to atleast one of the metal chassis and the package, wherein the cover is oneof metal or metalized plastic, and wherein the cover forms a waveguidebackshort for the waveguide.

In accordance with another example embodiment, a transceiver devicecomprises: an MMIC package; and a cover, wherein the cover is atransceiver RF cover, and wherein the transceiver RF cover forms a TXwaveguide backshort.

In accordance with another example embodiment, an antenna systemcomprises a transceiver, and the transceiver comprises: an MMIC package;and a cover, wherein the cover is a transceiver RF cover, and whereinthe transceiver RF cover forms a TX waveguide backshort.

In accordance with various embodiments, and with reference to FIG. 20, amethod 2000 of forming a mm-wave MMIC device comprises the steps of:forming a leadframe comprising leads (step 2010); overmolding theleadframe (step 2020); connecting an electronic device to the leadframewithin the package body (step 2030); and enclosing the electronic devicewithin the package (step 2040).

In various embodiments, the leads comprise one or more of the following:DC leads, RF leads, a microstrip, and an RF launch. In variousembodiments, the leadframe further comprises a pad, and forming aleadframe (step 2010) comprises deep downsetting the pad relative toother portions of the leadframe.

In various embodiments, overmolding the leadframe (step 2020) creates apackage body that is integral with the leadframe. In another exampleembodiment, overmolding the leadframe further includes overmolding atleast a portion of the microstrip.

In various embodiments, connecting an electronic device to the leadframewithin the package body (step 2030) further comprises wirebonding theelectronic device to bond pads of the leadframe. In various embodiments,the electronic device comprises an integrated circuit. Furthermore, invarious embodiments, the electronic device comprises an MMIC. In variousembodiments, enclosing the electronic device within the package (step2040) further comprises sealing the electronic device within a cavity byadding a package lid. In various embodiments, the package base andpackage lid form a package body portion with a protruding integratedpartial waveguide interface comprising the microstrip and the RF launch.In another example embodiment, enclosing the electronic device withinthe package (step 2040) further comprises overmolding the package baseto form a package body portion with a protruding integrated partialwaveguide interface.

In accordance with an additional example embodiment, a method ofmanufacturing an RF system further comprises the steps of: placing thepackage on a PWB (step 2050), reflow soldering the package to the PWB(step 2060), and securing the PWB to a chassis and securing a cover tothe chassis (step 2070). In one example embodiment, placing the packageis done using “pick and place” technology. In another exampleembodiment, placing the package is done by surface mounting the packageto the PWB.

In accordance with another example embodiment, the PWB is attached to achassis, and a cover is secured to the chassis. In this exampleembodiment, the chassis comprises a waveguide, and the package issurface mounted with the RF launch aligned with the waveguide. Invarious embodiments, the attached cover forms a backstop for thewaveguide.

In various embodiments, the integrated partial waveguide interface iscompleted to form a complete waveguide interface only after theovermolded package is completely assembled. In various embodiments, theintegrated partial waveguide interface is completed to form a completewaveguide interface only after the overmolded package is completelyassembled and attached to a chassis. In other example embodiments, theintegrated partial waveguide interface is completed to form a completewaveguide interface only after the overmolded package is completelyassembled, attached to a chassis, and a cover is attached. In yet otherexample embodiments, the integrated partial waveguide interface iscompleted by attaching a cover to a chassis with a launch of theintegrated partial waveguide interface located between the cover and thechassis. The chassis may, for example, be part of a transceiver system.

Thus, in various embodiments, an MMIC package may be formed in a costeffective manner. The MMIC package may be made relatively inexpensively(for example) through use of injection molding. Mass production isfacilitated, and at the MMIC package level, no PWB is used.

Moreover, the use of the MMIC package facilitates reliability, andmanufacturing efficiency. The MMIC package can be installed using a pickand place technology. The package can be surface mounted, and/or reflowsoldered. This is in contrast to hand soldering MMICs directly to thePWB. In this manner, rework may be reduced. Furthermore, these methodsfacilitate production of low cost/high volume packages. Moreover, heatdissipation is improved as compared to heat dissipation where the MMICis directly attached to the PWB. For example, heat dissipation may beover 20 watts over a small area (such as for example, 1 to 5 square mm,although other small area sizes may be used).

Use of the MMIC package gives rise to an issue regarding stackingtolerances. This issue is important in that the MMIC package/PWB/chassisinteraction can give rise to stresses and fractures if not accountedfor. These tolerance issues are inexpensively addressed using springlike leads.

In the prior art, it was not obvious to make a MMIC package and/orintegrated waveguide MMIC package out of plastic overmold material. Anall plastic encapsulated component would likely experience thermaltransfer problems. Moreover, if the waveguide interface were entirelymade of plastic, there might be problems with RF shielding and formingthe waveguide backshort. But the construction techniques describedherein facilitate a plastic MMIC package with desirable thermal transfercharacteristics. And the integrated partial waveguide interfacefacilitates forming a plastic MMIC package without the RF shielding andbackshort issues.

In various embodiments, the Intermediate Frequency signal could be inthe range of 0 to 10 GHz and the Local Oscillator and RF signals may bein the 10 to 100 GHz frequency ranges. Although any suitable frequencyranges may be used.

It should be noted that the term surface mounting is used herein in aslightly different convention. However, it is still the case that thecomponents discussed herein as being surface mounted can, in variousembodiments, be installed using standard surface mount manufacturingequipment and techniques. Thus, they are described as surface mountedeven though the mounting may be relative to two or more surfaces (e.g.,the pedestal and the PWB).

STATEMENTS OF INVENTION

In an example embodiment, a semiconductor device comprises: a moldedMMIC package including a MMIC; and a partial waveguide interface moldedinto the molded MMIC package. In one example embodiment, the molded MMICpackage and the partial waveguide interface are formed using a leadframethat is injection overmolded, and wherein the injection overmolding isperformed with a liquid crystal polymer material. In an exemplaryembodiment, an antenna system comprises a transceiver, and thetransceiver comprises such a semiconductor device; and further comprisesa cover, wherein the cover is a transceiver RF cover, and wherein thetransceiver RF cover forms a transmit waveguide backshort, and whereinthe combination of the cover and the partial waveguide interfacecomprises a complete waveguide interface.

In an example embodiment, a radio frequency (“RF”) MMIC packagecomprises: a package body portion comprising a MMIC disposed within thepackage body portion; a partial waveguide interface; an overmoldmaterial forming portions of both the package body portion and thepartial waveguide interface so as to cause the partial waveguideinterface to be an integral part of the package body portion; and aleadframe, wherein the leadframe is electrically connected to the MMIC,and wherein the leadframe forms part of both the package body portionand the waveguide interface.

In one example embodiment, the package body portion further comprises: apackage base; and a package lid connected to the package base to formthe package body portion, wherein the package lid is connected to thepackage base such that the MMIC is hermetically enclosed within a cavityinside the RF MMIC package. In one example embodiment, the overmoldmaterial is a liquid crystal polymer (“LOP”). In one example embodiment,the package lid is formed of at least one of the following materials:injection molded plastic, ceramic, stamped plastic or metal; and whereinthe materials are one of metal plated and not metal plated. In oneexample embodiment, a radio frequency absorbing material is provided ona first surface of the package lid, wherein the first surface of thepackage lid faces the die. In one example embodiment, the radiofrequency absorbing material comprises ecosorb. In one exampleembodiment, the package body portion is a fully encapsulated overmoldedpackage.

In one example embodiment, the RF MMIC package comprises more than oneintegrated partial waveguide interfaces. In one example embodiment, theintegrated partial waveguide interface is a first integrated partialwaveguide interface, and wherein the RF MMIC package comprises both thefirst integrated partial waveguide interface and a second integratedpartial waveguide interface. In one example embodiment, at least one ofthe following: the first integrated partial waveguide interface is aninput interface, and the second integrated partial waveguide interfaceis an output interface; the first and second integrated partialwaveguide interfaces are each an input interface; and the first andsecond integrated partial waveguide interfaces are each an outputinterface. In one example embodiment, at least one of the following: thefirst integrated partial waveguide interface is an input interface, andthe second integrated partial waveguide interface and a third integratedpartial waveguide interface are output interfaces; the first and secondintegrated partial waveguide interfaces are each an input interface, andthe third integrated partial waveguide interface is an output interface.In one example embodiment, the integrated partial waveguide interface isat least partially supported, at least on one side, by an overmoldmaterial integral with the overmold material of the package bodyportion. In one example embodiment, the integrated partial waveguideinterface comprises a signal conducting structure, supporting material,and a launch. In one example embodiment, the supporting material is thesame overmold material used in the rest of the MMIC package, and whereinthe supporting material is in contact with at least a portion of thesignal conducting structure.

In one example embodiment, the MMIC package is at least partially formedby one of: injection molding with an overmold material; and molding orcasting, with an overmold material. In one example embodiment, theovermold material comprises one of: any dielectric moldable material; aceramic; and a polymer. In one example embodiment, the polymer comprisesone of the following polymers: liquid crystal polymer (LCP),Polyphenylene Sulfide (PPS), Polyether ether ketone (PEEK), anythermoplastic polymer, and any thermoset polymer. In one exampleembodiment, the MMIC package is at least partially formed by molding orcasting, with an overmold material, and further comprising a slot in theovermold material configured for securely holding a portion of aleadframe. In one example embodiment, the die comprises a MMIC. In oneexample embodiment, the MMIC comprises a high power amplifier.

In one example embodiment, the MMIC package further comprises at leaston RF interface and at least one direct current (“DC”) interface, andwherein the DC interface is electrically connected to a printed wiringboard (“PWB”). In one example embodiment, the MMIC package furthercomprises a lead structure formed from a leadframe that is at leastpartially enclosed in an overmold material, wherein the lead structureforms the at least one DC interface. In one example embodiment, theleadframe comprises one of: copper, copper alloy, other metals. In oneexample embodiment, the MMIC is attached via wirebonds to the DCinterface inside the package. In one example embodiment, the at leastone DC interface comprises spring leads that are configured tocompensate for mechanical stresses and tolerances. In one exampleembodiment, the at least one RF and DC interfaces each comprise springleads. In one example embodiment, leads are shaped to provide controlledcharacteristic impedance. In one example embodiment, the MMIC packagefurther comprises at least one radio frequency (“RF”) interface, andwherein the RF interface is electrically connected to a printed wiringboard (“PWB”), and further comprising a lead structure formed from aleadframe that is at least partially enclosed in an overmold material,wherein the lead structure forms the at least one RF interface; whereinthe MMIC is attached to the RF interfaces inside the package viawirebonds; and wherein the at least one RF interface comprises springleads that are configured to compensate for mechanical stresses andtolerances.

In one example embodiment, the MMIC package further comprises anexternal electrically conductive cover (“cover”), and a waveguideinterface, wherein the partial waveguide interface is a first portion ofthe waveguide interface and the cover is a second portion of thewaveguide interface. In one example embodiment, the MMIC package furthercomprises an electrically conductive cover (“cover”), wherein thepartial waveguide interface comprises a first portion of a waveguideinterface, wherein the cover comprises a second portion of the waveguideinterface, and wherein the first and second portions of the waveguideinterface comprise a whole waveguide interface. In one exampleembodiment, the RF MMIC package is mounted to a chassis and the cover ismounted over at least the partial waveguide interface. In one exampleembodiment, the cover forms a waveguide backshort. In one exampleembodiment, the cover provides a holding force that retains the RF MMICpackage in fixed position relative to the chassis. In one exampleembodiment, the cover is a separate component from the RF MMIC package.In one example embodiment, the cover is made of metal or is metalized.In one example embodiment, cover provides a clamping/bolt down′ functionfor securing the RF MMIC package relative to the chassis. In one exampleembodiment, a transceiver comprises the MMIC package, wherein the RFMMIC package is mounted to a chassis, and wherein the transceiverfurther comprises a cover comprising a backshort, wherein the back shortis located over at least part of the integrated partial waveguideinterface, and wherein the RF MMIC package is clamped between a portionof the cover and the chassis. In one example embodiment, the cover isattached via screws or bolts. In one example embodiment, a transceiverdevice comprises the RF MMIC package, and a transceiver RF cover,wherein the transceiver RF cover forms a transmit waveguide backshort.

An example method of forming a mm-wave MMIC package comprises the stepsof: forming a leadframe comprising leads, wherein the leads include DCleads, RF leads, a waveguide transition, and an RF launch; overmoldingat least a portion of the waveguide transition and portions of theleadframe, wherein the overmolding creates a package base that isintegrated with a partial waveguide interface, wherein the partialwaveguide interface protrudes from the package base, wherein theintegrated partial waveguide interface comprises the waveguidetransition and the RF launch; and attaching and electrically connectinga MMIC to the leadframe within the package base.

In one example embodiment, the method further comprises adding a packagelid and sealing the MMIC within a cavity formed between the package lidand the package base, wherein the combination of the package lid and thepackage base form a package body portion. In one example embodiment,electrically connecting comprises wire bonding, and wherein attachingcomprises using epoxy to attach. One example embodiment furthercomprises the steps of: surface mounting the mm-wave MMIC package to achassis, wherein the chassis comprises a waveguide, wherein the packageis surface mounted with the RF launch aligned with the waveguide; andattaching a cover that forms a backshort for the waveguide. In oneexample embodiment, the integrated partial waveguide interface iscompleted to form a complete waveguide interface when the MMIC packageis completely assembled, attached to a chassis, and a cover is attached.In one example embodiment, the integrated partial waveguide interface iscompleted by attaching a cover to a chassis with a launch of theintegrated partial waveguide interface located between the cover and thechassis.

In an example embodiment, a high power, overmolded MMIC device isdisclosed, with one or more integrated partial waveguide interfaces,wherein high power is defined as thermal dissipation from the MMIC ofgreater than one of: 5 watts, 8 watts, or 10 watts, wherein the MMIC isa high frequency MMIC, wherein high frequency is defined as a frequencyof 8 GHz or higher. In one example embodiment, the MMIC device is one ofa power amplifier and a block up converter. In one example embodiment,the one or more integrated partial waveguide interfaces are each one of:an input interface and an output interface; two input interfaces; andtwo output interfaces.

In an example embodiment, a mm-wave MMIC device comprises: an overmoldedleadframe package; and an integrated partial wave guide interface thatis configured to work in conjunction with a separate waveguidebackshort.

In an example embodiment, a MMIC package comprises: a leadframe basedovermolded package (“overmolded package”), a die positioned within theovermolded package; and a partial waveguide interface, wherein thepartial waveguide interface is integral with the overmolded package. Inone example embodiment, the overmolded package does not comprise aprinted wiring board.

In an example embodiment, a mm-wave MMIC device comprises: an overmoldedleadframe package; and an integrated wave guide interface that does notinclude an integrated waveguide backshort. In an example embodiment, apartial waveguide interface is integrated with a package, wherein thepackage comprises a MMIC, an exposed heat sink, and leads. In an exampleembodiment, a high power amplifier comprises: a MMIC; a package with anexposed heat sink; and leads, wherein the leads are overmolded in thepackage.

In an example embodiment, a transceiver comprises: a chassis; a surfaceassociated with the chassis; a MMIC package supported by the surface,wherein the surface is configured to transfer heat away from the MMICand conduct the heat directly to the chassis of a next higher levelassembly, wherein the MMIC package is configured to be in contact withthe surface; and a cover, wherein the MMIC package is held in contactwith the surface by the cover, wherein the cover is bolted to thesurface, wherein the cover partially covers the MMIC package. In oneexample embodiment, the MMIC package comprises no bolt holes and is notdirectly bolted to the surface.

In an example embodiment, a housing comprises: a metal chassis having awaveguide; a printed wiring board (“PWB”) attached to the metal chassis;a package comprising a MMIC and a metal portion on a first surface ofthe package, the MMIC in direct thermal contact with the metal portion;the package electrically connected to the PWB, and wherein the metalportion of the package is attached directly to the metal chassisproviding a direct heat sink path from the MMIC to the metal chassis;wherein the package comprises a portion of an waveguide interface thatis integrated in the package, wherein the package is located so as toalign a probe portion of the waveguide interface with the waveguide inthe metal chassis; and a cover separately connected to the metalchassis, wherein the cover is one of a metal cover or a metalizedplastic cover, and wherein the cover forms a waveguide backshort for thewaveguide. In one example embodiment, the cover is also in contact withthe package, and provides a holding force to keep the package in contactwith the chassis. In one example embodiment, the cover provides asecondary heat sink path for the package.

In an example embodiment, a radio frequency (“RF”) MMIC packagecomprises: a package body portion comprising a MMIC disposed within thepackage body portion; a partial waveguide interface; an over-moldmaterial, wherein the overmold material is injection molded inconnection with both the package body portion and the partial waveguideinterface so as to cause the partial waveguide interface to be anintegral part of the package body portion; and a leadframe, wherein theleadframe is electrically connected to the MMIC, and wherein theleadframe forms part of both the package body portion and the waveguideinterface, wherein the package body portion further comprises: a packagebase; and a package lid connected to the package base to form thepackage body portion, wherein the package lid is connected to thepackage base such that the MMIC is hermetically enclosed within a cavityinside the RF MMIC package.

In one example embodiment, the package includes a bottom side heat sinkinterface. In one example embodiment, the system further comprises: achassis and a printed wiring board (“PWB”), wherein the PWB does notinterpose between a heat transfer portion of the package and a metalportion of the chassis. In one example embodiment, the die has a directthermal path through a portion of the leadframe to the bottom of theovermolded package. In one example embodiment, the system furthercomprises: a chassis and a printed wiring board (“PWB”), wherein theovermolded package is in electrical contact with the PWB and wherein thedie is in direct thermal contact with the chassis. In one exampleembodiment, the system further comprises: a chassis and a printed wiringboard (“PWB”), wherein the overmolded package comprises a heat sinkintegrated in the overmolded package, wherein the heat sink is flushwith a bottom surface of the overmolded package, wherein the heat sinkis in direct contact with the chassis when the overmolded package is incontact with the PWB and the chassis. In one example embodiment, thesystem further comprises a second leadframe that is a heat sinkleadframe, wherein the heat sink leadframe is configured to transferheat through an attached chassis, wherein the second leadframe is incontact with the MMIC. In one example embodiment, the system furthercomprises a leadframe in the overmolded package, wherein at least aportion of the leadframe is deep downset. In one example embodiment,deep downset means that a portion of the leadframe forms a first surfacethat is positioned within the overmolded package such that a metalsurface of a higher assembly level is in contact with the first surfaceof the overmolded package. In one example embodiment, the leadframe isdeep downset such that heat may be transferred from the die through themetal surface to an attached chassis. In one example embodiment, theMMIC is a high power MMIC, wherein high power is defined as thermaldissipation from the MMIC of greater than one of: 5 watts, 8 watts, or10 watts, wherein the MMIC is a high frequency MMIC, and wherein highfrequency is defined as a frequency of 8 GHz or higher. In one exampleembodiment, the system further comprises an electrically conductivecover (“cover”), wherein the partial waveguide interface comprises afirst portion of a waveguide interface, wherein the cover comprises asecond portion of the waveguide interface, and wherein the first andsecond portions of the waveguide interface comprise a whole waveguideinterface, wherein the overmolded package is mounted to a chassis andthe cover is mounted over at least the partial waveguide interface, andwherein the cover provides a secondary heat transfer path for removingheat from the overmolded package.

A method of forming a mm-wave MMIC package comprises the steps of:forming a leadframe comprising leads, wherein the leads include DCleads, RF leads, a waveguide transition, and an RF launch; overmoldingat least a portion of the waveguide transition and portions of theleadframe, wherein the overmolding creates a package base that isintegrated with a partial waveguide interface, wherein the partialwaveguide interface protrudes from the package base, wherein theintegrated partial waveguide interface comprises the waveguidetransition and the RF launch; and attaching and electrically connectinga MMIC to the leadframe within the package base; wherein the step offorming a leadframe further comprises deep downsetting the leadframerelative to other portions of the leadframe.

An example method of forming a mm-wave MMIC package comprises the stepsof: forming a leadframe comprising leads, wherein the leads include DCleads, RF leads, a waveguide transition, and an RF launch; overmoldingat least a portion of the waveguide transition and portions of theleadframe, wherein the overmolding creates a package base that isintegrated with a partial waveguide interface, wherein the partialwaveguide interface protrudes from the package base, wherein theintegrated partial waveguide interface comprises the waveguidetransition and the RF launch; and attaching and electrically connectinga MMIC to the leadframe within the package base; wherein the integratedpartial waveguide interface is completed to form a complete waveguideinterface when the MMIC package is completely assembled and attached toa chassis, and wherein the MMIC package comprises a heat sink integratedin the MMIC package, wherein the heat sink is flush with a bottomsurface of the MMIC package, wherein the heat sink is in direct contactwith the chassis when the MMIC package is in contact with a printedwiring board (“PWB”) and the chassis.

In the following description and/or claims, the terms coupled and/orconnected, along with their derivatives, may be used. In particularembodiments, connected may be used to indicate that two or more elementsare in direct physical and/or electrical contact with each other.Coupled may mean that two or more elements are in direct physical and/orelectrical contact. However, coupled may also mean that two or moreelements may not be in direct contact with each other, but yet may stillcooperate and/or interact with each other. Furthermore, couple may meanthat two objects are in communication with each other, and/orcommunicate with each other, such as two pieces of hardware.Furthermore, the term “and/or” may mean “and,” it may mean “or,” it maymean “exclusive-or,” it may mean “one,” it may mean “some, but not all,”it may mean “neither,” and/or it may mean “both,” although the scope ofclaimed subject matter is not limited in this respect.

It should be appreciated that the particular implementations shown anddescribed herein are illustrative of various embodiments including itsbest mode, and are not intended to limit the scope of the presentdisclosure in any way. For the sake of brevity, conventional techniquesfor signal processing, data transmission, signaling, and networkcontrol, and other functional aspects of the systems (and components ofthe individual operating components of the systems) may not be describedin detail herein. Furthermore, the connecting lines shown in the variousfigures contained herein are intended to represent example functionalrelationships and/or physical couplings between the various elements. Itshould be noted that many alternative or additional functionalrelationships or physical connections may be present in a practicalcommunication system.

While the principles of the disclosure have been shown in embodiments,many modifications of structure, arrangements, proportions, theelements, materials and components, used in practice, which areparticularly adapted for a specific environment and operatingrequirements without departing from the principles and scope of thisdisclosure. These and other changes or modifications are intended to beincluded within the scope of the present disclosure and may be expressedin the following claims.

1. (canceled)
 2. A semiconductor device comprising: a molded MonolithicMicrowave Integrated Circuit (“MMIC”) package including a MMIC, whereinthe molded MMIC package further comprises a heat sink interface inthermal contact with the MMIC for transferring heat away from the MMICthrough the heat sink interface, wherein the heat sink interface isintegrated in the molded MMIC package; and a waveguide launch moldedinto the molded MMIC package.
 3. The semiconductor device of claim 2,wherein the heat sink interface is a bottom side heat sink interface,and wherein either the heat sink interface is flush with a bottomsurface of the molded MMIC package, or the heat sink interface isrecessed from the bottom surface within the molded MMIC package, whereinthe bottom surface is a surface closest to a surface mounting side ofthe molded MMIC package.
 4. The semiconductor device of claim 2, whereinthe heat sink interface is a portion of a leadframe.
 5. Thesemiconductor device of claim 2, the molded MMIC package furthercomprising: a leadframe, wherein the leadframe is injection over-moldedwith an overmold material to form a package body portion, wherein theMMIC is electrically connected to at least a first portion of theleadframe, wherein the MMIC is disposed within the package body portion,and wherein the heat sink interface is a second portion of theleadframe; and a package lid connected to the package body portion, thepackage lid connected to the package body portion to hermeticallyenclose the MMIC within an air cavity inside the molded MMIC package. 6.The semiconductor device of claim 5, wherein the MMIC has a directthermal path through the second portion of the leadframe to a bottomside of the molded MMIC package.
 7. The semiconductor device of claim 5,wherein the second portion of the leadframe is a heat sink leadframe fortransferring heat from the MMIC to an attached chassis through the heatsink leadframe.
 8. The semiconductor device of claim 5, wherein at leastthe second portion of the leadframe is deep downset relative to thefirst portion of the leadframe.
 9. The semiconductor device of claim 5,wherein at least the second portion of the leadframe is deep downsetforming a first surface that is positioned within the molded MMICpackage such that a metal surface of a higher assembly level is incontact with the first surface of the molded MMIC package.
 10. Thesemiconductor device of claim 5, wherein the second portion of theleadframe is deep downset for transferring heat from the MMIC throughthe metal surface to an attached chassis.
 11. A transceiver comprising:a chassis, wherein the chassis comprises a waveguide; a moldedmonolithic microwave integrated circuit (MMIC) package comprising: aMMIC; a launch molded into the molded MMIC package; and a heat sinkinterface, wherein the molded MMIC package is mounted to the chassis,and wherein the heat sink interface is in thermal contact with the MMICand the chassis for transferring heat away from the MMIC through theheat sink interface to the chassis; and a cover, wherein the cover is anRF cover, and wherein the RF cover forms a waveguide backshort, andwherein the cover is mounted in contact with the chassis and the moldedMMIC package.
 12. The transceiver of claim 11, further comprising: aprinted wiring board (“PWB”), wherein the molded MMIC package iselectrically connected to the PWB, and wherein the PWB does notinterpose between a heat transfer portion of the molded MMIC package anda metal portion of the chassis.
 13. The transceiver of claim 11, furthercomprising: a printed wiring board (“PWB”), wherein the molded MMICpackage is in electrical contact with the PWB and wherein the MMIC is indirect thermal contact with the chassis.
 14. The transceiver of claim11, further comprising: a printed wiring board (“PWB”), wherein the heatsink interface is integrated in the molded MMIC package, wherein theheat sink interface is flush with a bottom surface of the molded MMICpackage, wherein the heat sink interface is in direct contact with thechassis when the molded MMIC package is in contact with the PWB and thechassis.
 15. A transceiver device comprising: a molded monolithicmicrowave integrated circuit (MMIC) package having a launch forcommunicating RF signals external to the molded MMIC package; a MMIClocated within the molded MMIC package; a cover; a housing having ametal chassis, wherein the metal chassis comprises a waveguide; whereinthe molded MMIC package is in thermal contact with the metal chassis fortransferring heat from the MMIC to the metal chassis, wherein with thelaunch is in proximity to the waveguide in the metal chassis; whereinthe cover is a separate component from the molded MMIC package, whereinthe cover is separately connected to at least one of the metal chassisand the molded MMIC package, wherein the cover is one of metal ormetalized plastic, and wherein the cover forms a transmit waveguidebackshort for the waveguide; and a printed wiring board (“PWB”) attachedto the metal chassis.
 16. The transceiver device of claim 15, whereinthe PWB does not interpose between a heat transfer portion of the moldedMMIC package and a metal portion of the metal chassis.
 17. Thetransceiver device of claim 15, wherein the molded MMIC packagecomprises a heat sink interface integrated in the molded MMIC package,wherein the heat sink interface is flush with a bottom surface of themolded MMIC package, wherein the heat sink interface is in directcontact with the metal chassis when the molded MMIC package is incontact with the PWB and the metal chassis.
 18. The transceiver deviceof claim 15, wherein the molded MMIC package comprises a metal portionon a first surface of the molded MMIC package, wherein the MMIC is indirect thermal contact with the metal portion, the molded MMIC packageis electrically connected to the PWB, and the metal portion of themolded MMIC package is physically in contact with the metal chassisproviding a direct heat sink path from the MMIC to the metal chassis.19. The transceiver device of claim 15, wherein the molded MMIC packagecomprises a leadframe that is integrated in the molded MMIC package,wherein the MMIC in the molded MMIC package has a direct thermal paththrough a portion of the leadframe to the metal chassis.
 20. Thetransceiver device of claim 15, wherein the metal chassis furthercomprises: a pedestal that is in thermal contact with the molded MMICpackage.
 21. The transceiver device of claim 20, wherein the molded MMICpackage further comprises a base leadframe providing a thermal interfacebetween the MMIC and the pedestal, wherein the MMIC is directly touchingthe base leadframe.